The acceptance management division at the seal packing, a opening or not. At the Lille tray, the electronic component packaging to stick into the work. If the expiry date of completion method from the manufacturing division at the opening, soldering, according to its condition. Treatment of weak parts, such as at the QFP and SOP and BGA and CSP lead at the pick-up element, use the static electricity countermeasure in place so as not to damage the lead. At・マウンター fall in and around the electronic parts should not be reused. At
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